Product Summary
The EPF10K50EQ240-2 is an enhanced Programmable Logic Device. Based on reconfigurable CMOS SRAM elements, the FLEX architecture of the EPF10K50EQ240-2 incorporates all features necessary to implement common gate array megafunctions. With up to 200,000 typical gates, the EPF10K50EQ240-2 provides the density, speed, and features to integrate entire systems, including multiple 32-bit buses, into a single device.
Parametrics
EPF10K50EQ240-2 absolute maximum ratings: (1)Supply voltage With respect to ground: –0.5 to 3.6 V; (2)DC input voltage: –2.0 to 5.75 V; (3)DC output current, per pin: –25 to 25 mA; (4)Storage temperature No bias: –65 to 150 ℃; (5)Ambient temperature Under bias: –65 to 135 ℃; (6)Junction temperature PQFP, TQFP, BGA, and FineLine BGA packages, under bias: 135 ℃, Ceramic PGA packages, under bias: 150 ℃.
Features
EPF10K50EQ240-2 features: (1)Embedded programmable logic devices (PLDs), providing system-on-a-programmable-chip (SOPC) integration in a single device: Enhanced embedded array for implementing megafunctions such as efficient memory and specialized logic functions, Dual-port capability with up to 16-bit width per embedded array block (EAB), Logic array for general logic functions; (2)High density: 30,000 to 200,000 typical gates, Up to 98,304 RAM bits (4,096 bits per EAB), all of which can be used without reducing logic capacity; (3)System-level features: MultiVoltTM I/O pins can drive or be driven by 2.5-V, 3.3-V, or 5.0-V devices, Low power consumption, Bidirectional I/O performance (tSU and tCO) up to 212 MHz.
Diagrams
EPF10K100ABC356-2 |
IC FLEX 10KA FPGA 100K 356-BGA |
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EPF10K100ABC356-2N |
IC FLEX 10KA FPGA 100K 356-BGA |
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EPF10K100ABC356-3 |
IC FLEX 10KA FPGA 100K 356-BGA |
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EPF10K100ABI600-2 |
IC FLEX 10KA FPGA 100K 600-BGA |
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EPF10K100ARC240-1 |
IC FLEX 10KA FPGA 100K 240-RQFP |
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EPF10K100ARC240-1N |
IC FLEX 10KA FPGA 100K 240-RQFP |
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