(China (Mainland))
Product Summary
The EPF10K70RC240-4N is the industry’s first embedded PLD. Based on reconfigurable CMOS SRAM elements, the Flexible Logic Element MatriX (FLEX) architecture of the EPF10K70RC240-4N incorporates all features necessary to implement common gate array megafunctions. With up to 250,000 gates, the EPF10K70RC240-4N provides the density, speed, and features to integrate entire systems, including multiple 32-bit buses, into a single device.
Parametrics
EPF10K70RC240-4N absolute maximum ratings: (1)Supply voltage With respect to ground: –2.0 to 7.0 V; (2)DC input voltage: –2.0 to 7.0 V; (3)DC output current, per pin: –25 to 25 mA; (4)Storage temperature No bias: –65 to 150 ℃; (5)Ambient temperature Under bias: –65 to 135 ℃; (6)Junction temperature Ceramic packages, under bias: 150 ℃, PQFP, TQFP, RQFP, and BGA packages, under bias: 135 ℃.
Features
EPF10K70RC240-4N features: (1)The industry’s first embedded programmable logic device (PLD) family, providing System-on-a-Programmable-Chip (SOPC) integration: Embedded array for implementing megafunctions, such as efficient memory and specialized logic functions, Logic array for general logic functions; (2)High density: 10,000 to 250,000 typical gates, Up to 40,960 RAM bits; 2,048 bits per embedded array block (EAB), all of which can be used without reducing logic capacity; (3)System-level features: MultiVoltTM I/O interface support, 5.0-V tolerant input pins in FLEX 10KA devices, Low power consumption (typical specification less than 0.5 mA in standby mode for most devices).
Diagrams
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 EPF10K100ABC356-2 |
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IC FLEX 10KA FPGA 100K 356-BGA |
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EPF10K100ABC356-2N |
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IC FLEX 10KA FPGA 100K 356-BGA |
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EPF10K100ABC356-3 |
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IC FLEX 10KA FPGA 100K 356-BGA |
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EPF10K100ABI600-2 |
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IC FLEX 10KA FPGA 100K 600-BGA |
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EPF10K100ARC240-1 |
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IC FLEX 10KA FPGA 100K 240-RQFP |
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EPF10K100ARC240-1N |
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IC FLEX 10KA FPGA 100K 240-RQFP |
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