(China (Mainland))
Product Summary
The EPF10K70GC503-3 is a embedded programmable logic device. The EPF10K70GC503-3 is the industrys first embedded PLD. Based on reconfigurable CMOS SRAM elements, the Flexible Logic Element MatriX (FLEX) architecture incorporates all features necessary to implement common gate array megafunctions. With up to 250,000 gates, the EPF10K70GC503-3 provides the density, speed, and features to integrate entire systems, including multiple 32-bit buses, into a single device.
Parametrics
EPF10K70GC503-3 absolute maximum ratings: (1)VCC Supply voltage With respect to ground: –2.0 7.0 V; (2)VI DC input voltage: –2.0 7.0 V; (3)IOUT DC output current, per pin: –25 25 mA; (4)TSTG Storage temperature No bias: –65 150 ℃; (5)TAMB Ambient temperature Under bias: –65 135 ℃; (6)TJ Junction temperature Ceramic packages, under bias: 150 ℃.
Features
EPF10K70GC503-3 features: (1)The industrys first embedded programmable logic device (PLD) family, providing System-on-a-Programmable-Chip (SOPC) integration; (2)Embedded array for implementing megafunctions, such as efficient memory and specialized logic functions; (3)Logic array for general logic functions; (4)High density; (5)10,000 to 250,000 typical gates (see Tables 1 and 2); (6)Up to 40,960 RAM bits; 2,048 bits per embedded array block (EAB), all of which can be used without reducing logic capacity; (7)System-level features; (8)MultiVoltTM I/O interface support; (9)5.0-V tolerant input pins in FLEXR 10KA devices; (10)Low power consumption (typical specification less than 0.5 mA in standby mode for most devices).
Diagrams
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 EPF10K100ABC356-2 |
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IC FLEX 10KA FPGA 100K 356-BGA |
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EPF10K100ABC356-2N |
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IC FLEX 10KA FPGA 100K 356-BGA |
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EPF10K100ABC356-3 |
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IC FLEX 10KA FPGA 100K 356-BGA |
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EPF10K100ABI600-2 |
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IC FLEX 10KA FPGA 100K 600-BGA |
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EPF10K100ARC240-1 |
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IC FLEX 10KA FPGA 100K 240-RQFP |
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EPF10K100ARC240-1N |
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IC FLEX 10KA FPGA 100K 240-RQFP |
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